23 documents found, page 1 of 3
Chlamydia trachomatis infection screening: yes or no?
Abreu Silva, Daniela Sofia; Macedo, Francisco; Quintal, DoloresChlamydia trachomatis infection is the most frequent bacterial sexually transmitted infection. Usually, it is asymptomatic but can lead to severe consequences, especially in females, such as inflammatory pelvic disease, infertility, ectopic pregnancy, and chronic pelvic pain. The global prevalence is about 3,8% in women and the majority of cases happen in 15-24 years-old people. Diagnosis is made with nucleic ...
Medicine without borders: challenges of the immigrant population
Abreu Silva, Daniela Sofia; Macedo, Francisco; Quintal, DoloresMigration is a phenomenon that is globally growing and that is also seen in Portugal. During the migration process, people overcome various transitions that can trigger off unbalance and enhance health problems. Immigrants are at particular risk of suffering disparities in healthcare accessibility and medical treatment opportunities because of multiple factors. The growing migrant population demands are a chall...
Dataset for additional information on the evaluation of thermal properties of t...
Silva-Oliveira, C. I.; Martinez-Martinez, D.; Couto, F. M.; Cunha, L.; Macedo, FranciscoThis paper provides additional negative data regarding the paper Evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films. In that paper, a matrix of samples was prepared to evaluate the so-called Extremum method for the analysis of Infrared (IR) radiometry data. Such matrix was composed by 3 types of films with 4 different thickness in 3 types of substrates...
Influence of the applied load on the creep behaviour of tin-silver-copper solder
Soares, Delfim; Ribeiro, Pedro E.; Capela, Pauline; Barros, Daniel A.; Cerqueira, M. F.; Teixeira, S. F. C. F.; Macedo, Francisco; Teixeira, J. CarlosDuring the life cycle of an electronic printed circuit boards (PCBs), the cold solder joints formation between the component and PCB are a failure mode that happen commonly. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. With today's solder joint thickness decreasing and increasing worki...
Fabrication, characterization and implementation of thermo resistive TiCu(N,O) ...
Oliveira, Eva; Silva, João Paulo; Laranjeira, Jorge; Macedo, Francisco; Lanceros-Méndez, S.; Vaz, F.; Ferreira, ArmandoThis paper presents the development of metallic thermoresistive thin film, providing an innovative solution to dynamically control the temperature during the injection molding process of polymeric parts. The general idea was to tailor the signal response of the nitrogen- and oxygen-doped titanium-copper thin film (TiCu(N,O))-based transducers, in order to optimize their use in temperature sensor devices. The re...
Influence of the microstructure on the creep behaviour of Tin-Silver-Copper solder
Ribeiro, Pedro Emanuel Abreu; Soares, Delfim; Cerqueira, M. F.; Teixeira, S. F. C. F.; Barros, Daniel Araújo; Teixeira, J. CarlosA common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. With today’s solder joint thickness decreasing and increasing working temperatures...
Effect of the soldering atmosphere on the wettability between Sn4.0Ag0.5Cu (in ...
Soares, Delfim; Leitão, H.; Lau, C. S.; Teixeira, J. Carlos; Ribas, L.; Alves, R.; Teixeira, S. F. C. F.; Cerqueira, M. F.; Macedo, FranciscoThe ‘‘degree of wetting,’’ which is related to the contact angle (h) between the molten solder and the substrate, is a useful parameter on the solderability process control. The contact angle, however, is strongly dependent on the type of substrate surface finish and used atmosphere (inert or non-inert). Furthermore, the surface tension, being an important parameter on the solderability process and performance,...
Jornalismo investigativo e grandes reportagens durante os 20 anos do regime mil...
Macedo, FranciscoSubmitted by Gisely Teixeira (gisely.teixeira@uniceub.br) on 2017-06-16T15:48:15Z No. of bitstreams: 1 20314320.pdf: 63303 bytes, checksum: 36b56791c9360c4739620f8f525f215f (MD5); Approved for entry into archive by Camila Loscha (camila.loscha@uniceub.br) on 2017-06-16T19:17:22Z (GMT) No. of bitstreams: 1 20314320.pdf: 63303 bytes, checksum: 36b56791c9360c4739620f8f525f215f (MD5); Made available in DSpace on 20...
Hormonal contraception and bleeding pattern changes: where do we stand?
Castro Coelho, Filipa; Macedo, Francisco; Freitas, CláudiaUnscheduled bleeding is a major current problem in women's health. The management of bleeding pattern changes in women using hormonal contraception is challenging.Recommendations for the best practices are provided where evidence exists.This paper provides an updated review regarding the approach of unscheduled bleeding in women who use hormonal contraception.
Influence of Copper layer content in the elastic and damping behavior of Glass-...
Carneiro, Vítor Hugo Pimenta; Capela, Paulina Araújo; Teixeira, J. Carlos; Teixeira, S. F. C. F.; Cerqueira, M. F.; Macedo, Francisco; Ribas, L.The impact in the elastic behavior and internal friction, caused by the introduction of Copper layers in Glass-Fiber/Epoxy Resin composites and temperature effects, were studied and evaluated recurring to Dynamic Mechanical Analysis. It is shown that the introduction of Copper layers increases the storage modulus of the composites and delays their glass transition temperature, however, it allows a faster transf...