Publicação
Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations
| Resumo: | This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved. |
|---|---|
| Autores principais: | Mendes, P. M. |
| Outros Autores: | Polyakov, A.; Bartek, M.; Burghartz, J. N.; Correia, J. H. |
| Assunto: | Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| Ano: | 2006 |
| País: | Portugal |
| Tipo de documento: | artigo |
| Tipo de acesso: | acesso aberto |
| Instituição associada: | Universidade do Minho |
| Idioma: | inglês |
| Origem: | RepositóriUM - Universidade do Minho |
| _version_ | 1867439246488371200 |
|---|---|
| author | Mendes, P. M. |
| author2 | Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| author2_role | author author author author |
| author_facet | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| author_role | author |
| contributor_name_str_mv | RepositóriUM - Universidade do Minho |
| country_str | PT |
| creators_json_txt | [{\"Person.name\":\"Mendes, P. M.\"},{\"Person.name\":\"Polyakov, A.\"},{\"Person.name\":\"Bartek, M.\"},{\"Person.name\":\"Burghartz, J. N.\"},{\"Person.name\":\"Correia, J. H.\"}] |
| datacite.contributors.contributor.contributorName.fl_str_mv | RepositóriUM - Universidade do Minho |
| datacite.creators.creator.creatorName.fl_str_mv | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| datacite.date.Accepted.fl_str_mv | 2006-01-01T00:00:00Z |
| datacite.date.available.fl_str_mv | 2007-01-04T11:53:57Z |
| datacite.date.embargoed.fl_str_mv | 2007-01-04T11:53:57Z |
| datacite.rights.fl_str_mv | http://purl.org/coar/access_right/c_abf2 |
| datacite.subjects.subject.fl_str_mv | Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| datacite.titles.title.fl_str_mv | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| dc.contributor.none.fl_str_mv | RepositóriUM - Universidade do Minho |
| dc.creator.none.fl_str_mv | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| dc.date.Accepted.fl_str_mv | 2006-01-01T00:00:00Z |
| dc.date.available.fl_str_mv | 2007-01-04T11:53:57Z |
| dc.date.embargoed.fl_str_mv | 2007-01-04T11:53:57Z |
| dc.format.none.fl_str_mv | application/pdf |
| dc.identifier.none.fl_str_mv | https://hdl.handle.net/1822/5939 |
| dc.language.none.fl_str_mv | eng |
| dc.publisher.none.fl_str_mv | Elsevier |
| dc.rights.none.fl_str_mv | http://purl.org/coar/access_right/c_abf2 |
| dc.subject.none.fl_str_mv | Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| dc.title.fl_str_mv | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| dc.type.none.fl_str_mv | http://purl.org/coar/resource_type/c_6501 |
| description | This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved. |
| dirty | 0 |
| eu_rights_str_mv | openAccess |
| format | article |
| fulltext.url.fl_str_mv | https://repositorium.uminho.pt/bitstreams/5ea785a9-0732-48cd-aeeb-7ab14062d4c9/download |
| id | rum_8486b975cb8a24a903781eee3e596c0c |
| identifier.url.fl_str_mv | https://hdl.handle.net/1822/5939 |
| instacron_str | repositorium |
| institution | Universidade do Minho |
| instname_str | Universidade do Minho |
| language | eng |
| network_acronym_str | rum |
| network_name_str | RepositóriUM - Universidade do Minho |
| oai_identifier_str | oai:repositorium.uminho.pt:1822/5939 |
| organization_str_mv | urn:organizationAcronym:repositorium |
| person_str_mv | Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
| publishDate | 2006 |
| publisher.none.fl_str_mv | Elsevier |
| reponame_str | RepositóriUM - Universidade do Minho |
| repository_id_str | urn:repositoryAcronym:rum |
| service_str_mv | urn:repositoryAcronym:rum |
| spelling | engElsevierengThis paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.application/pdfengIntegrated chip-size antennas for wireless microsystems : fabrication and design ConsiderationsMendes, P. M.Polyakov, A.Bartek, M.Burghartz, J. N.Correia, J. H.HostingInstitutionOrganizationalRepositóriUM - Universidade do Minhoe-mailmailto:repositorium@usdb.uminho.ptrepositorium@usdb.uminho.ptCITATION"Sensors and actuators A physical". ISSN 0924-4247. 125:2 (Jan. 2006) 217-222.ISSNIsPartOf0924-4247DOIIsPartOf10.1016/j.sna.2005.07.0162007-01-04T11:53:57Z2006-012006-01-01T00:00:00ZHandlehttps://hdl.handle.net/1822/5939http://purl.org/coar/access_right/c_abf2open accessChip-size antennaWireless microsystemWafer-level packagingExcimer laser ablationVia fabricationwater-level packagingwireless inicrosystein438579 bytesliteraturehttp://purl.org/coar/resource_type/c_6501journal articlehttp://purl.org/coar/access_right/c_abf2application/pdffulltexthttps://repositorium.uminho.pt/bitstreams/5ea785a9-0732-48cd-aeeb-7ab14062d4c9/download |
| spellingShingle | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations Mendes, P. M. Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| status | SINGLETON |
| subject.fl_str_mv | Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| title | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| title_full | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| title_fullStr | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| title_full_unstemmed | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| title_short | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| title_sort | Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations |
| topic | Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| topic_facet | Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein |
| url | https://hdl.handle.net/1822/5939 |
| visible | 1 |