Teixeira, J. S. M. (2022). Copper Electroplating for Wafer Level Packaging. Study of Plating Suppressor and Electrolyte Working Time on Copper Nucleation and Growth.
Chicago Style (17th ed.) CitationTeixeira, Joana Sofia Moutinho. Copper Electroplating for Wafer Level Packaging. Study of Plating Suppressor and Electrolyte Working Time on Copper Nucleation and Growth. 2022.
MLA (9th ed.) CitationTeixeira, Joana Sofia Moutinho. Copper Electroplating for Wafer Level Packaging. Study of Plating Suppressor and Electrolyte Working Time on Copper Nucleation and Growth. 2022.
Warning: These citations may not always be 100% accurate.