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Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations

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Resumo:This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.
Autores principais:Mendes, P. M.
Outros Autores:Polyakov, A.; Bartek, M.; Burghartz, J. N.; Correia, J. H.
Assunto:Chip-size antenna Wireless microsystem Wafer-level packaging Excimer laser ablation Via fabrication water-level packaging wireless inicrosystein
Ano:2006
País:Portugal
Tipo de documento:artigo
Tipo de acesso:acesso aberto
Instituição associada:Universidade do Minho
Idioma:inglês
Origem:RepositóriUM - Universidade do Minho

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