Detalhes bibliográficos
| Resumo: | A novel fabrication process for a high-aspect-ratio recording and stimulation intracortical neural microelectrode array is described. Using a combination of dicing and KOH wet-etching, microspikes are formed on the surface of a n-type (100), 4 mm thick, silicon wafer. Deep 3 mm cuts are performed in order to produce sharped tip pillars of high-aspect-ratio (0.2x0.2x3 mm). Thermomigration is employed as a selective doping technique performing electrically insulated pillars due to the pn back biased junctions formed between each pair of n-type substrate and p+ migrated trails. Gold is deposited over the spikes in order to have a good ionic interface with the neural tissue, while the remaining surface is passivated with a biocompatible layer of cyanoacrylate. The final result is a deep penetrating electrode array with potential new applications in neuroprosthetics’ research field. |
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| Autores principais: | Peixoto, A. C. |
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| Outros Autores: | Silva, A. F.; Dias, N. S.; Correia, J. H. |
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| Assunto: | Invasive neural electrode Microelectrode array Thermomigration Silicon |
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| Ano: | 2012 |
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| País: | Portugal |
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| Tipo de documento: | comunicação em conferência |
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| Tipo de acesso: | acesso restrito |
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| Instituição associada: | Universidade do Minho |
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| Idioma: | inglês |
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| Origem: | RepositóriUM - Universidade do Minho |
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