Publicação
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
| Resumo: | This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. |
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| Autores principais: | Mendes, P. M. |
| Outros Autores: | Polyakov, A.; Bartek, M.; Burghartz, J. N.; Correia, J. H. |
| Assunto: | On-chip antenna Through-wafer vias Glass processing Laser ablation |
| Ano: | 2003 |
| País: | Portugal |
| Tipo de documento: | comunicação em conferência |
| Tipo de acesso: | acesso aberto |
| Instituição associada: | Universidade do Minho |
| Idioma: | inglês |
| Origem: | RepositóriUM - Universidade do Minho |
| Resumo: | This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. |
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