Detalhes bibliográficos
| Resumo: | This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. Since electrodes length reaches up to 4 mm, the main hindrance was the 2 mm cutting depth limit allowed for dicing machines with regular blades. This new procedure consisted on modifying Z-axis calibration, so cuts as deep as the exposure of blades were possible. The employment of proper blades for each fabrication step was also mandatory. Thin and high-exposure blades were used for deep cuts in silicon wafers, and V-shaped blades were employed to produce sharpened tips on the electrodes. Moreover, parameters as very low-cut speeds were essential to avoid wafer chipping and microcracks. Results showed high-precision and high-quality cuts in all steps of the 3D MEA fabrication, without unnecessary additional steps of etching post-processing. The optimized fabrication process was successfully demonstrated with a 3D neural probe array comprising 36 individually addressable electrodes. |
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| Autores principais: | Gonçalves, Sandra Beatriz Tomé |
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| Outros Autores: | Oliveira, Maria J.; Peixoto, Alexandre Coumiotis Moreira; Ferreira da Silva, Alexandre; Correia, J. H. |
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| Assunto: | Dicing saw Diamond blade Neural microelectrode array Silicon wafer |
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| Ano: | 2016 |
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| País: | Portugal |
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| Tipo de documento: | artigo |
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| Tipo de acesso: | acesso restrito |
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| Instituição associada: | Universidade do Minho |
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| Idioma: | inglês |
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| Origem: | RepositóriUM - Universidade do Minho |
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