Publicação
High-resistivity polycrystalline silicon as RF substrate in wafer-level packaging
| Resumo: | High-resistivity polycrystalline silicon (HRPS) is presented as a novel low-cost and low-loss substrate for radio-frequency (RF) passive components in wafer-level packaging and integrated passive networks. A record quality factor (Q¼11; 1 GHz; 34 nH) and very low loss (0.65 dB=cm; 17 GHz) are demonstrated for inductors and coplanar waveguides, respectively, on HRPS. |
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| Autores principais: | Polyakov, A. |
| Outros Autores: | Sinaga, S. M.; Mendes, P. M.; Correia, J. H.; Bartek, M.; Burghartz, J. N. |
| Assunto: | Wafer level packaging Integrated antenna |
| Ano: | 2005 |
| País: | Portugal |
| Tipo de documento: | artigo |
| Tipo de acesso: | acesso aberto |
| Instituição associada: | Universidade do Minho |
| Idioma: | inglês |
| Origem: | RepositóriUM - Universidade do Minho |
| Resumo: | High-resistivity polycrystalline silicon (HRPS) is presented as a novel low-cost and low-loss substrate for radio-frequency (RF) passive components in wafer-level packaging and integrated passive networks. A record quality factor (Q¼11; 1 GHz; 34 nH) and very low loss (0.65 dB=cm; 17 GHz) are demonstrated for inductors and coplanar waveguides, respectively, on HRPS. |
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