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Analysis of the bonding process and materials optimization for mitigating the Yellow Border defect on optically bonded automotive display panels

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Detalhes bibliográficos
Resumo:The Optical Bonding (OB) technology has become a critical aspect of the performance of displays, and an essential requisite of their supply chain. This paper presents the development and the implementation of a technological solution to the OB of automotive instrument panel displays. The goal is to select and develop the adequate materials and bonding techniques that can meet the rigorous performance, quality, cost and productivity of OB displays for the automotive industry. The implementation of a display wet-OB production line is firstly presented. The process is then optimised by selecting the adequate silicone based OB materials that can eliminate defects such as Yellow Border, YB (a type of MURA defect), meeting the application requirements at reduced cycle time. (C) 2017 Elsevier B.V. All rights reserved.
Autores principais:Cruz, Sílvia Manuela Ferreira
Outros Autores:Sousa, Andre; Viana, J. C.; Martins, Tiago
Assunto:Wet-optical bonding Display Silicone
Ano:2017
País:Portugal
Tipo de documento:artigo
Tipo de acesso:acesso restrito
Instituição associada:Universidade do Minho
Idioma:inglês
Origem:RepositóriUM - Universidade do Minho
Descrição
Resumo:The Optical Bonding (OB) technology has become a critical aspect of the performance of displays, and an essential requisite of their supply chain. This paper presents the development and the implementation of a technological solution to the OB of automotive instrument panel displays. The goal is to select and develop the adequate materials and bonding techniques that can meet the rigorous performance, quality, cost and productivity of OB displays for the automotive industry. The implementation of a display wet-OB production line is firstly presented. The process is then optimised by selecting the adequate silicone based OB materials that can eliminate defects such as Yellow Border, YB (a type of MURA defect), meeting the application requirements at reduced cycle time. (C) 2017 Elsevier B.V. All rights reserved.