Publicação
Integrated chip-size antenna for wireless microsystems : fabrication and design considerations
| Resumo: | This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Two different fabrication options based on via formation in glass substrates using excimer laser ablation or powder blasting are presented. |
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| Autores principais: | Mendes, P. M. |
| Outros Autores: | Polyakov, A.; Bartek, M.; Burghartz, J. N.; Correia, J. H. |
| Assunto: | Chip-size antenna Wafer level packaging Wireless microsystem Laser ablation Powder blasting |
| Ano: | 2003 |
| País: | Portugal |
| Tipo de documento: | comunicação em conferência |
| Tipo de acesso: | acesso aberto |
| Instituição associada: | Universidade do Minho |
| Idioma: | inglês |
| Origem: | RepositóriUM - Universidade do Minho |
| Resumo: | This paper reports on fabrication and design considerations of an integrated folded shortedpatch chip-size antenna for applications in short-range wireless microsystems and operating frequency of 5.7 GHz. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Two different fabrication options based on via formation in glass substrates using excimer laser ablation or powder blasting are presented. |
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